Gyda Nawarungruang

Experience

Professional Experience

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R&D Systems Evaluation Engineer

Boston ScientificArden Hills, MNSeptember 2025 – Present

I investigate complex system behavior in implantable cardiac devices through characterization, failure analysis, and cross-functional debugging.

  • Physiological Sensor Noise Investigation: Built experiments to isolate PCB, IC, and mechanical sources of sensor artifacts.

  • HW/FW/SW Integration: Verified system behavior across releases, device states, telemetry, and hardware configurations.

  • Feature Ownership: Owned verification, protocol improvements, regression, and automation for four core features.

Technical focus

  • Systems Debugging
  • Sensor Characterization
  • Experimental Design / DOE
  • HW/FW Investigation
  • Test Automation
  • Requirements Traceability

Previous Experience

R&D Hardware Design Intern

Boston ScientificArden Hills, MNJune 2024 – August 2024

Developed and validated power-monitoring diagnostics for a mixed-signal IC on implantable cardiac devices.

  • Power Diagnostic Algorithm: Developed an assembly-based algorithm to monitor device current, log measurements, and flag abnormal events.

  • Digital Verification: Verified diagnostic behavior in Xcelium using SystemVerilog and carried results through to system-board testing.

  • Hardware Characterization: Measured current across pacing amplitudes and impedance loads using JTAG, PicoScope, LabVIEW, and Python.

Technical focus

  • Digital Verification
  • Assembly Programming
  • Mixed Signal Testing
  • Power Characterization
  • SystemVerilog / Xcelium
  • JTAG & Lab Instrumentation

Electrical Engineering Intern

PA ConsultingConcord, MAJune 2023 – August 2023

Built embedded hardware and firmware for consumer devices, from peripheral drivers to PCB design and sensing experiments.

  • Embedded Firmware & UI: Wrote SPI drivers and C-based firmware for environmental sensing, SD storage, and e-paper display control.

  • PCB Design: Designed a handheld controller in Altium, from schematic capture and custom footprints through layout and routing.

  • Capacitive Sensing: Ran hardware experiments, performed PCB rework, and evaluated alternative designs to improve sensing performance.

Technical focus

  • Embedded C & SPI
  • PCB Design & Layout
  • Sensor Integration
  • Hardware Prototyping
  • Capacitive Sensing
  • Experimental Design / DOE

Education

M.S. Computer Engineering

Northwestern UniversityEvanston, IL
September 2024 – June 2025GPA: 3.9/4.0

B.S. Electrical Engineering

Northwestern UniversityEvanston, IL
September 2021 – June 2025GPA: 3.9/4.0